Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
16 Pin Female SOP
End 2
16 Pin Male DIP
End 1 Number of Contacts
16
End 2 Number of Contacts
16
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Gold over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOIC to DIP Sockets
Adaptics that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
RSD 6.342
RSD 1.268,465 komadno (u pakovanju od 5) (bez PDV-a)
RSD 7.611
RSD 1.522,158 komadno (u pakovanju od 5) (s PDV-om)
5
RSD 6.342
RSD 1.268,465 komadno (u pakovanju od 5) (bez PDV-a)
RSD 7.611
RSD 1.522,158 komadno (u pakovanju od 5) (s PDV-om)
5
Informacije o stanju skladišta trenutno nisu dostupne.
Proverite ponovno kasnije.
količina | Jedinična cena | Po pakovanje |
---|---|---|
5 - 120 | RSD 1.268,465 | RSD 6.342 |
125 - 370 | RSD 1.157,425 | RSD 5.787 |
375 - 995 | RSD 1.072,513 | RSD 5.363 |
1000 - 1995 | RSD 975,843 | RSD 4.879 |
2000+ | RSD 941,878 | RSD 4.709 |
Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
16 Pin Female SOP
End 2
16 Pin Male DIP
End 1 Number of Contacts
16
End 2 Number of Contacts
16
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Gold over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOIC to DIP Sockets
Adaptics that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.