Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
SSOP 28
End 2
DIP 28
End 1 Number of Contacts
28
End 2 Number of Contacts
28
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
RSD 20.621
RSD 4.124,144 komadno (u pakovanju od 5) (bez PDV-a)
RSD 24.745
RSD 4.948,973 komadno (u pakovanju od 5) (s PDV-om)
5
RSD 20.621
RSD 4.124,144 komadno (u pakovanju od 5) (bez PDV-a)
RSD 24.745
RSD 4.948,973 komadno (u pakovanju od 5) (s PDV-om)
5
Informacije o stanju skladišta trenutno nisu dostupne.
Proverite ponovno kasnije.
količina | Jedinična cena | Po pakovanje |
---|---|---|
5 - 120 | RSD 4.124,144 | RSD 20.621 |
125 - 370 | RSD 3.763,591 | RSD 18.818 |
375 - 995 | RSD 3.487,952 | RSD 17.440 |
1000 - 1995 | RSD 3.175,734 | RSD 15.879 |
2000+ | RSD 3.063,388 | RSD 15.317 |
Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
SSOP 28
End 2
DIP 28
End 1 Number of Contacts
28
End 2 Number of Contacts
28
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.