Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
QSOP 16
End 2
DIP 16
End 1 Number of Contacts
16
End 2 Number of Contacts
16
End 1 Type
QSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
RSD 7.609
RSD 1.521,897 komadno (u pakovanju od 5) (bez PDV-a)
RSD 9.131
RSD 1.826,276 komadno (u pakovanju od 5) (s PDV-om)
5
RSD 7.609
RSD 1.521,897 komadno (u pakovanju od 5) (bez PDV-a)
RSD 9.131
RSD 1.826,276 komadno (u pakovanju od 5) (s PDV-om)
5
Informacije o stanju skladišta trenutno nisu dostupne.
Proverite ponovno kasnije.
količina | Jedinična cena | Po pakovanje |
---|---|---|
5 - 120 | RSD 1.521,897 | RSD 7.609 |
125 - 370 | RSD 1.389,955 | RSD 6.950 |
375 - 995 | RSD 1.286,754 | RSD 6.434 |
1000 - 1995 | RSD 1.171,795 | RSD 5.859 |
2000+ | RSD 1.129,992 | RSD 5.650 |
Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
QSOP 16
End 2
DIP 16
End 1 Number of Contacts
16
End 2 Number of Contacts
16
End 1 Type
QSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.