Fischer Elektronik Heatsink, Universal Square Alu, 28.5K/W, 10 x 10 x 10mm, Conductive Foil

RS kataloški broj:: 674-4747robna marka: Fischer ElektronikProizvođački broj:: ICK BGA 10x10x10
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Tehnička dokumentacija

Tehnički podaci

Brand

Fischer Elektronik

For Use With

Universal Square Alu

Length

10mm

Width

10mm

Height

10mm

Dimensions

10 x 10 x 10mm

Thermal Resistance

28.5K/W

Mounting

Conductive Foil

Colour

Black

Package Type

BGA

Material

Aluminium

Zemlja podrijetla

Germany

Detalji o proizvodu

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).

BGA Heatsinks

Informacije o stanju skladišta trenutno nisu dostupne.

€ 2,90

€ 2,90 Each (bez PDV-a)

€ 3,39

€ 3,39 Each (s PDV-om)

Fischer Elektronik Heatsink, Universal Square Alu, 28.5K/W, 10 x 10 x 10mm, Conductive Foil

1

Dostupno u više komada 1
1€ 2,90
2€ 5,80
3€ 8,70
4€ 11,60
5€ 14,50
6€ 17,40
7€ 20,30
8€ 23,20
9€ 26,10
10€ 27,30
11€ 30,03
12€ 32,76
13€ 35,49
14€ 38,22
15€ 40,95

€ 2,90

€ 2,90 Each (bez PDV-a)

€ 3,39

€ 3,39 Each (s PDV-om)

Fischer Elektronik Heatsink, Universal Square Alu, 28.5K/W, 10 x 10 x 10mm, Conductive Foil
Informacije o stanju skladišta trenutno nisu dostupne.

1

Dostupno u više komada 1
1€ 2,90
2€ 5,80
3€ 8,70
4€ 11,60
5€ 14,50
6€ 17,40
7€ 20,30
8€ 23,20
9€ 26,10
10€ 27,30
11€ 30,03
12€ 32,76
13€ 35,49
14€ 38,22
15€ 40,95

Informacije o stanju skladišta trenutno nisu dostupne.

Provjerite ponovno kasnije.

količinaJedinična cijena
1 - 9€ 2,90
10 - 24€ 2,73
25+€ 2,70

Tehnička dokumentacija

Tehnički podaci

Brand

Fischer Elektronik

For Use With

Universal Square Alu

Length

10mm

Width

10mm

Height

10mm

Dimensions

10 x 10 x 10mm

Thermal Resistance

28.5K/W

Mounting

Conductive Foil

Colour

Black

Package Type

BGA

Material

Aluminium

Zemlja podrijetla

Germany

Detalji o proizvodu

Fischer Elektronik ICK BGA Series Heatsink

ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).

BGA Heatsinks