Tehnička dokumentacija
Tehnički podaci
Brand
PanasonicDimensions
230 x 180mm
Thickness
0.07mm
Length
230mm
Width
180mm
Thermal Conductivity
1000W/m·K
Material
Graphite
Zemlja podrijetla
Japan
Detalji o proizvodu
Panasonic Pyrolytic Graphite Sheet (PGS) Type EYG
These range of Panasonic PGS thermal graphite sheet is a very thin, synthetically-made, highly oriented graphite polymer film manufactured for thermal management/heat-sink applications. The PGS graphite sheets are particularly well-suited for use in constrained spaces or to provide supplemental heat-sinking to existing areas. With excellent thermal conductivity (2 to 4 times that of copper), Panasonic 's PGS thermal graphite sheets are flexible (withstand repeated bending) and can be cut into customized shapes. Applications include cellular phones, DVC, DSC, PC and peripherals, pickup, semiconductor manufacturing equipment, and optical communications equipment.
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Proverite ponovno kasnije.
RSD 10.843
Each (bez PDV-a)
RSD 13.011
Each (s PDV-om)
1
RSD 10.843
Each (bez PDV-a)
RSD 13.011
Each (s PDV-om)
1
Kupujte na veliko
količina | Jedinična cena |
---|---|
1 - 9 | RSD 10.843 |
10 - 24 | RSD 10.059 |
25 - 49 | RSD 9.863 |
50 - 99 | RSD 9.798 |
100+ | RSD 9.732 |
Tehnička dokumentacija
Tehnički podaci
Brand
PanasonicDimensions
230 x 180mm
Thickness
0.07mm
Length
230mm
Width
180mm
Thermal Conductivity
1000W/m·K
Material
Graphite
Zemlja podrijetla
Japan
Detalji o proizvodu
Panasonic Pyrolytic Graphite Sheet (PGS) Type EYG
These range of Panasonic PGS thermal graphite sheet is a very thin, synthetically-made, highly oriented graphite polymer film manufactured for thermal management/heat-sink applications. The PGS graphite sheets are particularly well-suited for use in constrained spaces or to provide supplemental heat-sinking to existing areas. With excellent thermal conductivity (2 to 4 times that of copper), Panasonic 's PGS thermal graphite sheets are flexible (withstand repeated bending) and can be cut into customized shapes. Applications include cellular phones, DVC, DSC, PC and peripherals, pickup, semiconductor manufacturing equipment, and optical communications equipment.