Tehnička dokumentacija
Tehnički podaci
Brand
JAESeries
IL-G
Pitch
2.5mm
Number Of Contacts
3
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Mounting Type
Through Hole
Connector System
Wire to Board
Termination Method
Solder
Contact Material
Brass
Contact Plating
Tin
Current Rating
3.0A
Zemlja podrijetla
Japan
Detalji o proizvodu
JAE IL-G Series 2.5 mm Wire to Board PCB Header Connectors
IL-G series 2.5 mm wire to board PCB pin header connectors with a low profile design, having a height of just 10 mm when mated. These housings of these PCB pin headers feature a polarization key to prevent mismating and a friction locking mechanism for a secure mating connection. These IL-G series headers are available straight or right angle mounting and mate with the IL-G series crimp housings.
Informacije o stanju skladišta trenutno nisu dostupne.
Proverite ponovno kasnije.
RSD 87,525
komadno (u pakovanju od 10) (bez PDV-a)
RSD 105,03
komadno (u pakovanju od 10) (s PDV-om)
10
RSD 87,525
komadno (u pakovanju od 10) (bez PDV-a)
RSD 105,03
komadno (u pakovanju od 10) (s PDV-om)
10
Kupujte na veliko
količina | Jedinična cena | Po pakovanje |
---|---|---|
10 - 40 | RSD 87,525 | RSD 875 |
50+ | RSD 84,913 | RSD 849 |
Tehnička dokumentacija
Tehnički podaci
Brand
JAESeries
IL-G
Pitch
2.5mm
Number Of Contacts
3
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Mounting Type
Through Hole
Connector System
Wire to Board
Termination Method
Solder
Contact Material
Brass
Contact Plating
Tin
Current Rating
3.0A
Zemlja podrijetla
Japan
Detalji o proizvodu
JAE IL-G Series 2.5 mm Wire to Board PCB Header Connectors
IL-G series 2.5 mm wire to board PCB pin header connectors with a low profile design, having a height of just 10 mm when mated. These housings of these PCB pin headers feature a polarization key to prevent mismating and a friction locking mechanism for a secure mating connection. These IL-G series headers are available straight or right angle mounting and mate with the IL-G series crimp housings.