Molex Micro-Fit 3.0 Series Straight Through Hole PCB Header, 4 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded

RS kataloški broj:: 670-0368brend: MolexProizvođački broj:: 43045-0427Distrelec Article No.: 30157739
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Tehnička dokumentacija

Tehnički podaci

Brand

Molex

Series

MICRO-FIT 3.0

Pitch

3.0mm

Number Of Contacts

4

Number Of Rows

2

Body Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Mounting Type

Through Hole

Termination Method

Solder

Contact Plating

Tin

Contact Material

Brass

Series Number

43045

Current Rating

5.0A

Voltage Rating

250.0 V

Detalji o proizvodu

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with PCB Polarizing Peg, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

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Informacije o stanju skladišta trenutno nisu dostupne.

Proverite ponovno kasnije.

Informacije o stanju skladišta trenutno nisu dostupne.

RSD 343,57

komadno (u pakovanju od 5) (bez PDV-a)

RSD 412,284

komadno (u pakovanju od 5) (s PDV-om)

Molex Micro-Fit 3.0 Series Straight Through Hole PCB Header, 4 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded
Odaberite vrstu pakovanja

RSD 343,57

komadno (u pakovanju od 5) (bez PDV-a)

RSD 412,284

komadno (u pakovanju od 5) (s PDV-om)

Molex Micro-Fit 3.0 Series Straight Through Hole PCB Header, 4 Contact(s), 3.0mm Pitch, 2 Row(s), Shrouded
Informacije o stanju skladišta trenutno nisu dostupne.
Odaberite vrstu pakovanja

Kupujte na veliko

količinaJedinična cenaPo pakovanje
5 - 95RSD 343,57RSD 1.718
100 - 370RSD 246,90RSD 1.234
375 - 1495RSD 245,594RSD 1.228
1500+RSD 210,322RSD 1.052

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više

Tehnička dokumentacija

Tehnički podaci

Brand

Molex

Series

MICRO-FIT 3.0

Pitch

3.0mm

Number Of Contacts

4

Number Of Rows

2

Body Orientation

Straight

Shrouded/Unshrouded

Shrouded

Connector System

Wire to Board

Mounting Type

Through Hole

Termination Method

Solder

Contact Plating

Tin

Contact Material

Brass

Series Number

43045

Current Rating

5.0A

Voltage Rating

250.0 V

Detalji o proizvodu

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with PCB Polarizing Peg, 43045 Series

Micro-Fit 3.0 3mm pitch wire to board dual row PCB headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To help position and align these Micro-Fit 3.0 headers to the PCB board, PCB polarising pegs are incorporated into the connector design. part numbers ending in xx12, xx13 and xx14 also feature kinked solder legs for additional PCB retention. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Molex Micro-Fit 3.0 Series

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više