Heatsink, Universal Square Alu, 0.83°C/W, 100 x 100 x 15mm, PCB Mount

RS kataloški broj:: 903-3087brend: RS PRO
brand-logo
Prikaži sve u Heatsinks

Tehnička dokumentacija

Tehnički podaci

Brand

RS Pro

For Use With

Universal Square Alu

Length

100mm

Width

100mm

Height

15mm

Dimensions

100 x 100 x 15mm

Thermal Resistance

0.83°C/W

Mounting

PCB Mount

Series

100

Application

High Power Semiconductor Device, Optoelectronic Device

Material

Aluminium

Finish

Anodized

Zemlja podrijetla

United Kingdom

Detalji o proizvodu

Heat Sink 109AB Series, 100mm Wide x 15mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

Informacije o stanju skladišta trenutno nisu dostupne.

Proverite ponovno kasnije.

Informacije o stanju skladišta trenutno nisu dostupne.

RSD 2.613

Each (bez PDV-a)

RSD 3.135

Each (s PDV-om)

Heatsink, Universal Square Alu, 0.83°C/W, 100 x 100 x 15mm, PCB Mount

RSD 2.613

Each (bez PDV-a)

RSD 3.135

Each (s PDV-om)

Heatsink, Universal Square Alu, 0.83°C/W, 100 x 100 x 15mm, PCB Mount
Informacije o stanju skladišta trenutno nisu dostupne.

Kupujte na veliko

količinaJedinična cena
1 - 9RSD 2.613
10+RSD 2.417

Tehnička dokumentacija

Tehnički podaci

Brand

RS Pro

For Use With

Universal Square Alu

Length

100mm

Width

100mm

Height

15mm

Dimensions

100 x 100 x 15mm

Thermal Resistance

0.83°C/W

Mounting

PCB Mount

Series

100

Application

High Power Semiconductor Device, Optoelectronic Device

Material

Aluminium

Finish

Anodized

Zemlja podrijetla

United Kingdom

Detalji o proizvodu

Heat Sink 109AB Series, 100mm Wide x 15mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.