RS PRO Heatsink, Universal Rectangular Alu, 0.24°C/W, 100 x 250 x 30mm, PCB Mount

RS kataloški broj:: 903-3172brend: RS PRO
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Tehnička dokumentacija

Tehnički podaci

Brand

RS Pro

For Use With

Universal Rectangular Alu

Length

100mm

Width

250mm

Height

30mm

Dimensions

100 x 250 x 30mm

Thermal Resistance

0.24°C/W

Mounting

PCB Mount

Series

100

Application

High Power Semiconductor Device, Optoelectronic Device

Material

Aluminium

Finish

Anodized

Zemlja podrijetla

United Kingdom

Detalji o proizvodu

Heat Sink 132AB Series, 250mm Wide x 30mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

Informacije o stanju skladišta trenutno nisu dostupne.

Proverite ponovno kasnije.

Informacije o stanju skladišta trenutno nisu dostupne.

RSD 8.511

Each (bez PDV-a)

RSD 10.213

Each (s PDV-om)

RS PRO Heatsink, Universal Rectangular Alu, 0.24°C/W, 100 x 250 x 30mm, PCB Mount

RSD 8.511

Each (bez PDV-a)

RSD 10.213

Each (s PDV-om)

RS PRO Heatsink, Universal Rectangular Alu, 0.24°C/W, 100 x 250 x 30mm, PCB Mount
Informacije o stanju skladišta trenutno nisu dostupne.

Kupujte na veliko

količinaJedinična cena
1 - 9RSD 8.511
10 - 24RSD 7.945
25+RSD 7.920

Tehnička dokumentacija

Tehnički podaci

Brand

RS Pro

For Use With

Universal Rectangular Alu

Length

100mm

Width

250mm

Height

30mm

Dimensions

100 x 250 x 30mm

Thermal Resistance

0.24°C/W

Mounting

PCB Mount

Series

100

Application

High Power Semiconductor Device, Optoelectronic Device

Material

Aluminium

Finish

Anodized

Zemlja podrijetla

United Kingdom

Detalji o proizvodu

Heat Sink 132AB Series, 250mm Wide x 30mm High

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.