Tehnička dokumentacija
Tehnički podaci
Brand
TE ConnectivityGender
Female
For Use With
AMPMODU MOD IV Connector Housing
Series
AMPMODU MOD V
Minimum Wire Size mm²
0.03mm²
Termination Method
Crimp
Maximum Wire Size mm²
0.09mm²
Contact Plating
Tin
Minimum Wire Size AWG
32AWG
Contact Material
Phosphor Bronze
Maximum Wire Size AWG
28AWG
Maximum Contact Resistance
12mΩ
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+105°C
Detalji o proizvodu
Mod V Contact
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
Informacije o stanju skladišta trenutno nisu dostupne.
Proverite ponovno kasnije.
RSD 39,19
komad (isporučivo u vrećici) (bez PDV-a)
RSD 47,028
komad (isporučivo u vrećici) (s PDV-om)
100
RSD 39,19
komad (isporučivo u vrećici) (bez PDV-a)
RSD 47,028
komad (isporučivo u vrećici) (s PDV-om)
100
Kupujte na veliko
količina | Jedinična cena | Po kesa |
---|---|---|
100 - 400 | RSD 39,19 | RSD 3.919 |
500 - 900 | RSD 33,965 | RSD 3.397 |
1000 - 2400 | RSD 31,352 | RSD 3.135 |
2500+ | RSD 27,433 | RSD 2.743 |
Tehnička dokumentacija
Tehnički podaci
Brand
TE ConnectivityGender
Female
For Use With
AMPMODU MOD IV Connector Housing
Series
AMPMODU MOD V
Minimum Wire Size mm²
0.03mm²
Termination Method
Crimp
Maximum Wire Size mm²
0.09mm²
Contact Plating
Tin
Minimum Wire Size AWG
32AWG
Contact Material
Phosphor Bronze
Maximum Wire Size AWG
28AWG
Maximum Contact Resistance
12mΩ
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+105°C
Detalji o proizvodu
Mod V Contact
A rang of TE Connectivity High Contact Pressure (HCP) Contacts for AMPMODU V connectors.
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.