TE Connectivity 2.54mm Pitch Vertical 16 Way, Through Hole Standard Pin Closed Frame IC Dip Socket

RS kataloški broj:: 798-1546brend: TE ConnectivityProizvođački broj:: 4-1571551-4
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Tehnička dokumentacija

Tehnički podaci

Number Of Contacts

16

Mounting Type

Through Hole

Pin Type

Standard

Pitch

2.54mm

Row Width

2.54mm

Frame Type

Closed Frame

Termination Method

Solder

Contact Plating

Gold

Orientation

Vertical

Length

20.32mm

Width

10.16mm

Depth

4.57mm

Dimensions

20.32 x 10.16 x 4.57mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

+105°C

Housing Material

Thermoplastic

Contact Material

Beryllium Copper

Detalji o proizvodu

TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Augat 500 Series

PCB DIP sockets with stamped and formed contacts in a thermoplastic closed frame insulator. These PCB DIP sockets have a 2.54mm centerline with a 7.62 mm row spacing. The contacts of these PCB DIP IC sockets are gold plated with 4 fingered mating.

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RSD 392

Each (bez PDV-a)

RSD 470

Each (s PDV-om)

TE Connectivity 2.54mm Pitch Vertical 16 Way, Through Hole Standard Pin Closed Frame IC Dip Socket

RSD 392

Each (bez PDV-a)

RSD 470

Each (s PDV-om)

TE Connectivity 2.54mm Pitch Vertical 16 Way, Through Hole Standard Pin Closed Frame IC Dip Socket
Informacije o stanju skladišta trenutno nisu dostupne.

Kupujte na veliko

količinaJedinična cena
1 - 9RSD 392
10 - 24RSD 353
25 - 99RSD 333
100+RSD 320

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više

Tehnička dokumentacija

Tehnički podaci

Number Of Contacts

16

Mounting Type

Through Hole

Pin Type

Standard

Pitch

2.54mm

Row Width

2.54mm

Frame Type

Closed Frame

Termination Method

Solder

Contact Plating

Gold

Orientation

Vertical

Length

20.32mm

Width

10.16mm

Depth

4.57mm

Dimensions

20.32 x 10.16 x 4.57mm

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

+105°C

Housing Material

Thermoplastic

Contact Material

Beryllium Copper

Detalji o proizvodu

TE Connectivity PCB DIP Sockets with Stamped and Formed Contacts - Augat 500 Series

PCB DIP sockets with stamped and formed contacts in a thermoplastic closed frame insulator. These PCB DIP sockets have a 2.54mm centerline with a 7.62 mm row spacing. The contacts of these PCB DIP IC sockets are gold plated with 4 fingered mating.

Zamisliti. Stvoriti. Surađivati

PRIDRUŽITE SE BESPLATNO

Bez skrivenih naknada!

design-spark
design-spark
  • Preuzmite i koristite naš softver DesignSpark za svoje PCB i 3D mehaničke dizajne
  • Pregledajte i doprinesite sadržaju internet stranice i foruma
  • Preuzmite 3D modele, sheme i otiske s više od milijun proizvoda
Kliknite ovdje kako biste saznali više