Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
28 Pin Female SOP
End 2
28 Pin Male DIP
End 1 Number of Contacts
28
End 2 Number of Contacts
28
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Gold over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOIC to DIP Sockets
Adaptics that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
RSD 16.597
RSD 3.319,433 komadno (u pakovanju od 5) (bez PDV-a)
RSD 19.917
RSD 3.983,32 komadno (u pakovanju od 5) (s PDV-om)
5
RSD 16.597
RSD 3.319,433 komadno (u pakovanju od 5) (bez PDV-a)
RSD 19.917
RSD 3.983,32 komadno (u pakovanju od 5) (s PDV-om)
5
Informacije o stanju skladišta trenutno nisu dostupne.
Proverite ponovno kasnije.
količina | Jedinična cena | Po pakovanje |
---|---|---|
5 - 120 | RSD 3.319,433 | RSD 16.597 |
125 - 370 | RSD 3.029,423 | RSD 15.147 |
375 - 995 | RSD 2.807,344 | RSD 14.037 |
1000 - 1995 | RSD 2.556,525 | RSD 12.783 |
2000+ | RSD 2.465,081 | RSD 12.325 |
Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
28 Pin Female SOP
End 2
28 Pin Male DIP
End 1 Number of Contacts
28
End 2 Number of Contacts
28
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Gold over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOIC to DIP Sockets
Adaptics that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.