Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
28 Pin Female SOP
End 2
28 Pin Male DIP
End 1 Number of Contacts
28
End 2 Number of Contacts
28
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Gold over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOIC to DIP Sockets
Adaptics that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
Informacije o stanju skladišta trenutno nisu dostupne.
Proverite ponovno kasnije.
RSD 2.485,982
komadno (u pakovanju od 5) (bez PDV-a)
RSD 2.983,178
komadno (u pakovanju od 5) (s PDV-om)
5
RSD 2.485,982
komadno (u pakovanju od 5) (bez PDV-a)
RSD 2.983,178
komadno (u pakovanju od 5) (s PDV-om)
5
Kupujte na veliko
količina | Jedinična cena | Po pakovanje |
---|---|---|
5 - 120 | RSD 2.485,982 | RSD 12.430 |
125 - 370 | RSD 2.269,128 | RSD 11.346 |
375 - 995 | RSD 2.101,916 | RSD 10.510 |
1000 - 1995 | RSD 1.913,801 | RSD 9.569 |
2000+ | RSD 1.845,871 | RSD 9.229 |
Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
28 Pin Female SOP
End 2
28 Pin Male DIP
End 1 Number of Contacts
28
End 2 Number of Contacts
28
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Gold over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOIC to DIP Sockets
Adaptics that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.