Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
24 Pin Female SOP
End 2
24 Pin Male DIP
End 1 Number of Contacts
24
End 2 Number of Contacts
24
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Gold over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOIC to DIP Sockets
Adaptics that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
Informacije o stanju skladišta trenutno nisu dostupne.
Proverite ponovno kasnije.
RSD 9.504
RSD 1.900,738 komadno (u pakovanju od 5) (bez PDV-a)
RSD 11.404
RSD 2.280,886 komadno (u pakovanju od 5) (s PDV-om)
5
RSD 9.504
RSD 1.900,738 komadno (u pakovanju od 5) (bez PDV-a)
RSD 11.404
RSD 2.280,886 komadno (u pakovanju od 5) (s PDV-om)
5
Kupujte na veliko
količina | Jedinična cena | Po pakovanje |
---|---|---|
5 - 120 | RSD 1.900,738 | RSD 9.504 |
125 - 370 | RSD 1.734,831 | RSD 8.674 |
375 - 995 | RSD 1.608,116 | RSD 8.041 |
1000 - 1995 | RSD 1.464,417 | RSD 7.322 |
2000+ | RSD 1.413,47 | RSD 7.067 |
Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
24 Pin Female SOP
End 2
24 Pin Male DIP
End 1 Number of Contacts
24
End 2 Number of Contacts
24
End 1 Type
SOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Gold over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOIC to DIP Sockets
Adaptics that will convert the Small Outline ICs (SOIC) to a dual in line (DIP) package format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.