Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
SSOP 20
End 2
DIP 20
End 1 Number of Contacts
20
End 2 Number of Contacts
20
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
Informacije o stanju skladišta trenutno nisu dostupne.
Proverite ponovno kasnije.
RSD 2.775,992
komadno (u pakovanju od 5) (bez PDV-a)
RSD 3.331,19
komadno (u pakovanju od 5) (s PDV-om)
5
RSD 2.775,992
komadno (u pakovanju od 5) (bez PDV-a)
RSD 3.331,19
komadno (u pakovanju od 5) (s PDV-om)
5
Kupujte na veliko
količina | Jedinična cena | Po pakovanje |
---|---|---|
5 - 120 | RSD 2.775,992 | RSD 13.880 |
125 - 370 | RSD 2.547,381 | RSD 12.737 |
375 - 995 | RSD 2.351,428 | RSD 11.757 |
1000 - 1995 | RSD 2.155,476 | RSD 10.777 |
2000+ | RSD 2.057,50 | RSD 10.287 |
Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
SSOP 20
End 2
DIP 20
End 1 Number of Contacts
20
End 2 Number of Contacts
20
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.