Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
QSOP 16
End 2
DIP 16
End 1 Number of Contacts
16
End 2 Number of Contacts
16
End 1 Type
QSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
Informacije o stanju skladišta trenutno nisu dostupne.
Proverite ponovno kasnije.
RSD 1.469,643
komadno (u pakovanju od 5) (bez PDV-a)
RSD 1.763,572
komadno (u pakovanju od 5) (s PDV-om)
5
RSD 1.469,643
komadno (u pakovanju od 5) (bez PDV-a)
RSD 1.763,572
komadno (u pakovanju od 5) (s PDV-om)
5
Kupujte na veliko
količina | Jedinična cena | Po pakovanje |
---|---|---|
5 - 120 | RSD 1.469,643 | RSD 7.348 |
125 - 370 | RSD 1.339,008 | RSD 6.695 |
375 - 995 | RSD 1.234,50 | RSD 6.172 |
1000 - 1995 | RSD 1.123,46 | RSD 5.617 |
2000+ | RSD 1.084,27 | RSD 5.421 |
Tehnička dokumentacija
Tehnički podaci
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
QSOP 16
End 2
DIP 16
End 1 Number of Contacts
16
End 2 Number of Contacts
16
End 1 Type
QSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Zemlja podrijetla
United Kingdom
Detalji o proizvodu
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.