Tehnička dokumentacija
Tehnički podaci
Proizvođač
MolexSeries
iGrid 2.0
Product Type
PCB Header
Pitch
2mm
Current
2A
Housing Material
Polyamide
Number of Contacts
14
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
iGrid Wire to Board Dual Row System
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Gold
Row Pitch
2mm
Termination Type
Solder
Minimum Operating Temperature
-40°C
Tail Pin Length
3.2mm
Maximum Operating Temperature
105°C
Standards/Approvals
UL E29179
Voltage
250V
Zemlja podrijetla
Japan
Detalji o proizvodu
The Molex iGrid PCB header made up of the brass metal and having the gold plating. The header through hole termination method. The header has maximum current per contact 2A and maximum voltage 250V AC.
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PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
Informacije o stanju skladišta trenutno nisu dostupne.
€ 196,32
€ 196,32 1 Tray of 100 (bez PDV-a)
1
€ 196,32
€ 196,32 1 Tray of 100 (bez PDV-a)
Informacije o stanju skladišta trenutno nisu dostupne.
1
Zamisliti. Stvoriti. Surađivati
PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
Tehnička dokumentacija
Tehnički podaci
Proizvođač
MolexSeries
iGrid 2.0
Product Type
PCB Header
Pitch
2mm
Current
2A
Housing Material
Polyamide
Number of Contacts
14
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
iGrid Wire to Board Dual Row System
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Gold
Row Pitch
2mm
Termination Type
Solder
Minimum Operating Temperature
-40°C
Tail Pin Length
3.2mm
Maximum Operating Temperature
105°C
Standards/Approvals
UL E29179
Voltage
250V
Zemlja podrijetla
Japan
Detalji o proizvodu
The Molex iGrid PCB header made up of the brass metal and having the gold plating. The header through hole termination method. The header has maximum current per contact 2A and maximum voltage 250V AC.
Zamisliti. Stvoriti. Surađivati
PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
