Tehnička dokumentacija
Tehnički podaci
Proizvođač
MolexProduct Type
PCB Header
Series
Micro-Fit 3.0
Pitch
3mm
Current
5A
Number of Contacts
12
Housing Material
Thermoplastic
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Surface
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250V
Detalji o proizvodu
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Informacije o stanju skladišta trenutno nisu dostupne.
€ 11,50
€ 2,30 Each (Supplied on a Reel) (bez PDV-a)
€ 14,38
€ 2,875 Each (Supplied on a Reel) (s PDV-om)
Proizvodno pakiranje (kolut)
5
€ 11,50
€ 2,30 Each (Supplied on a Reel) (bez PDV-a)
€ 14,38
€ 2,875 Each (Supplied on a Reel) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
Proizvodno pakiranje (kolut)
5
Tehnička dokumentacija
Tehnički podaci
Proizvođač
MolexProduct Type
PCB Header
Series
Micro-Fit 3.0
Pitch
3mm
Current
5A
Number of Contacts
12
Housing Material
Thermoplastic
Number of Rows
2
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Surface
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3mm
Termination Type
Solder
Contact Gender
Male
Maximum Operating Temperature
125°C
Mating Pin Length
3mm
Standards/Approvals
No
Voltage
250V
Detalji o proizvodu
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals