Tehnička dokumentacija
Tehnički podaci
Proizvođač
STMicroelectronicsProduct Type
MOSFET
Channel Type
Type N
Maximum Continuous Drain Current Id
64A
Maximum Drain Source Voltage Vds
650V
Package Type
ACEPACK SMIT
Mount Type
Surface
Pin Count
3
Maximum Drain Source Resistance Rds
41mΩ
Typical Gate Charge Qg @ Vgs
116nC
Minimum Operating Temperature
-55°C
Maximum Gate Source Voltage Vgs
25V
Maximum Operating Temperature
150°C
Standards/Approvals
No
Automotive Standard
No
Zemlja podrijetla
Philippines
Detalji o proizvodu
The STMicroelectronics combination of two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. The DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.
Zamisliti. Stvoriti. Surađivati
PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
Informacije o stanju skladišta trenutno nisu dostupne.
€ 8.834,00
€ 44,17 Each (On a Reel of 200) (bez PDV-a)
200
€ 8.834,00
€ 44,17 Each (On a Reel of 200) (bez PDV-a)
Informacije o stanju skladišta trenutno nisu dostupne.
200
Zamisliti. Stvoriti. Surađivati
PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
Tehnička dokumentacija
Tehnički podaci
Proizvođač
STMicroelectronicsProduct Type
MOSFET
Channel Type
Type N
Maximum Continuous Drain Current Id
64A
Maximum Drain Source Voltage Vds
650V
Package Type
ACEPACK SMIT
Mount Type
Surface
Pin Count
3
Maximum Drain Source Resistance Rds
41mΩ
Typical Gate Charge Qg @ Vgs
116nC
Minimum Operating Temperature
-55°C
Maximum Gate Source Voltage Vgs
25V
Maximum Operating Temperature
150°C
Standards/Approvals
No
Automotive Standard
No
Zemlja podrijetla
Philippines
Detalji o proizvodu
The STMicroelectronics combination of two MOSFETs in a half-bridge topology. The ACEPACK SMIT is a very compact and rugged power module in a surface mount package for easy assembly. The DBC substrate, the ACEPACK SMIT package offers low thermal resistance coupled with an isolated top-side thermal pad. The high design flexibility of the package enables several configurations, including phase legs, boost, and single switch through different combinations of the internal power switches.
Zamisliti. Stvoriti. Surađivati
PRIDRUŽITE SE BESPLATNO
Bez skrivenih naknada!
