Tehnička dokumentacija
Tehnički podaci
Brand
IsocomMount Type
Through Hole
Product Type
Optocoupler
Maximum Forward Voltage
1.4V
Number of Channels
4
Packaging
Tape & Reel
Number of Pins
16
Package Type
DIP
Input Current Type
AC
Typical Rise Time
4μs
Isolation Voltage
5300Vrms
Minimum Operating Temperature
30°C
Maximum Current Transfer Ratio
100%
Maximum Operating Temperature
100°C
Standards/Approvals
CECC 00802, DEMKO, VDE 0884, UL, SEMKO, NEMKO, FIMKO, EN60950, BSI
Typical Fall Time
3μs
Minimum Current Transfer Ratio
20%
Series
TIL196
Automotive Standard
No
Zemlja podrijetla
Thailand
Detalji o proizvodu
The TIL194, TIL195, TIL196 series of optically coupled isolators consist of two infrared light emitting diodes connected in inverse parallel and NPN silicon photo transistors in space efficient dual in line plastic packages.
Informacije o stanju skladišta trenutno nisu dostupne.
KM 60,96
KM 2,438 Each (In a Tube of 25) (bez PDV-a)
KM 71,32
KM 2,853 Each (In a Tube of 25) (s PDV-om)
25
KM 60,96
KM 2,438 Each (In a Tube of 25) (bez PDV-a)
KM 71,32
KM 2,853 Each (In a Tube of 25) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
25
| količina | Jedinična cijena | Po cijev |
|---|---|---|
| 25 - 25 | KM 2,438 | KM 60,96 |
| 50 - 100 | KM 2,327 | KM 58,16 |
| 125+ | KM 2,282 | KM 57,05 |
Tehnička dokumentacija
Tehnički podaci
Brand
IsocomMount Type
Through Hole
Product Type
Optocoupler
Maximum Forward Voltage
1.4V
Number of Channels
4
Packaging
Tape & Reel
Number of Pins
16
Package Type
DIP
Input Current Type
AC
Typical Rise Time
4μs
Isolation Voltage
5300Vrms
Minimum Operating Temperature
30°C
Maximum Current Transfer Ratio
100%
Maximum Operating Temperature
100°C
Standards/Approvals
CECC 00802, DEMKO, VDE 0884, UL, SEMKO, NEMKO, FIMKO, EN60950, BSI
Typical Fall Time
3μs
Minimum Current Transfer Ratio
20%
Series
TIL196
Automotive Standard
No
Zemlja podrijetla
Thailand
Detalji o proizvodu
The TIL194, TIL195, TIL196 series of optically coupled isolators consist of two infrared light emitting diodes connected in inverse parallel and NPN silicon photo transistors in space efficient dual in line plastic packages.
