Tehnička dokumentacija
Tehnički podaci
Brand
MolexProduct Type
PCB Header
Series
Zero-Hachi
Pitch
0.8mm
Current
1A
Number of Contacts
2
Housing Material
Thermoplastic
Number of Rows
1
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Surface
Contact Material
Copper Alloy
Contact Plating
Matt Tin
Minimum Operating Temperature
-20°C
Row Pitch
0.8mm
Termination Type
Surface Mount
Contact Gender
Male
Maximum Operating Temperature
105°C
Mating Pin Length
2mm
Standards/Approvals
RoHS, UL
Zemlja podrijetla
Korea, Republic Of
Detalji o proizvodu
The Molex the Zero-Hachi header has 0.80mm pitch wire to board connector system and contains 2 circuit size range address the concerns of shrinking electronic device space across industries.
Informacije o stanju skladišta trenutno nisu dostupne.
KM 352,34
KM 1,409 Each (Supplied on a Reel) (bez PDV-a)
KM 412,24
KM 1,649 Each (Supplied on a Reel) (s PDV-om)
Proizvodno pakovanje (kolut)
250
KM 352,34
KM 1,409 Each (Supplied on a Reel) (bez PDV-a)
KM 412,24
KM 1,649 Each (Supplied on a Reel) (s PDV-om)
Informacije o stanju skladišta trenutno nisu dostupne.
Proizvodno pakovanje (kolut)
250
| količina | Jedinična cijena | Po kolut |
|---|---|---|
| 250 - 490 | KM 1,409 | KM 14,09 |
| 500 - 990 | KM 1,342 | KM 13,42 |
| 1000+ | KM 1,32 | KM 13,20 |
Tehnička dokumentacija
Tehnički podaci
Brand
MolexProduct Type
PCB Header
Series
Zero-Hachi
Pitch
0.8mm
Current
1A
Number of Contacts
2
Housing Material
Thermoplastic
Number of Rows
1
Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Surface
Contact Material
Copper Alloy
Contact Plating
Matt Tin
Minimum Operating Temperature
-20°C
Row Pitch
0.8mm
Termination Type
Surface Mount
Contact Gender
Male
Maximum Operating Temperature
105°C
Mating Pin Length
2mm
Standards/Approvals
RoHS, UL
Zemlja podrijetla
Korea, Republic Of
Detalji o proizvodu
The Molex the Zero-Hachi header has 0.80mm pitch wire to board connector system and contains 2 circuit size range address the concerns of shrinking electronic device space across industries.